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@ has mentioned TLE8104E - what about thermal package/heat dissipation? will those multichannel chips cope with all channels switched on simultaneously? (just thoughts)

puff wrote: ↑

Sat Dec 29, 2018 10:15 pm

plus what about thermal package/heat dissipation? will those multichannel chips cope with all channels switched on simultaneously? (just thoughts)

@ can you please use TLE8104E datasheet numbers and post heat dissipation numbers?

looked through the datasheet.
https://www.infineon.com/dgdl/Infineon-TLE8104E-DS-v01_04-en.pdf?fileId=db3a304318f3fe2901190401cfda7f25
1. typical on-state resistance is 0.32Ohm
2. nominal load per channel 1A
3. it requires thermal vias.
4. Junction to case 2.1 K/W, with Pv=3W, junction to ambient, with all channels active - 26K/W, Pv=3W

but anyway, seems not an issue for injectors?

5. however, there are some inductive load considerations listed in paragraph 5.3.3
+
Output Clamping Energy (single event), linearly decreasing current1) - Max 50mJ

Any takers to make a KiCAD module?

Locking this thread for this obsolete 2010 chip. My new best friends are 2013 TLE8110EE and 2018 TLE8110ED (I hope these can use the same board?)

See https://rusefi.com/forum/viewtopic.php?f=4&t=1471